Once again, Danpal leads the way in innovation with the development of our kinetic panel, the first of its kind. This panel’s color-shift technology blazes a new path for design possibilities that couldn’t have previously been imagined. Credit goes to the engineers at the Danpal research and development team who met the challenge of developing a panel with unique esthetic appeal. It was at the October 2019 Trade Fair for Plastics and Rubber, during the EPSE Awards Competition at the Dusseldorf K Fair that Danpal was honored in the Innovation category for our Danpalon Kinetic panel.
Kinetic Façade Buildings: Studio Legal Terrero & Mejía
Seeking to generate a new image for an existing structure, the Studio Legal Terrero & Mejia, architect Oscar Torrejón relied upon the concepts of the future, of innovation, and of quality in order to carry out the refurbishment of this building. Utilizing the characteristics of the materials, the Danpalon Kinetic panels, the architect created an interior space with a greater sense of size and lightness. Within, elements that distorted the overall global objective were eliminated in order to unify the materials that were used. The objective was to create a flexible workspace surrounded by a unique façade and a waiting room with the aim of reflecting the evolution and growth of the Studio Legal Terrero & Mejia. Danpal innovative materials and the architect’s vision made it possible to create a building which would honor the memory of the previous structure while becoming a point of reference at the national and regional levels for this Dominican Republic architectural icon.
Danpalon Kinetic Façade Buildings
Torrejón had praise for the characteristics of the Danpalon Kinetic material and its technical qualities. The variety of colors and textures enabled the architectural team to generate a balanced array for the volume and bring an updated image of the space.
You can count on Danpal to deliver the cutting-edge materials that are already working to design the architecture of the future.